Get started developing with the NVIDIA® Jetson AGX Orin™ Developer Kit. It includes a high-performance, power-efficient Jetson AGX Orin module, and can emulate the other Jetson Orin modules. With up to 275 TOPS for running the NVIDIA AI software stack, this developer kit lets you create advanced robotics and edge AI applications for manufacturing, logistics, retail, service, agriculture, smart city, healthcare, and life sciences.
8x AI performance: a giant leap forward for Edge AI compare to Jetson AGX Xavier
The newest member of Jetson Family, NVIDIA® Jetson AGX Orin™ Developer Kit, provides a giant leap forward for Robotics and Edge AI. With up to 275 TOPS of AI performance and power configurable between 15W and 50W, you now have more than 6X the performance of NVIDIA® Jetson AGX Xavier™ in the same compact form-factor for developing advanced robots and other autonomous machine products.
NVIDIA® Jetson AGX Orin developer kit contains a Jetson AGX Orin module with heat sink and reference carrier board, 802.11ac/abgn wireless Network Interface Controller, USB-C power adapter, and cord together with a quick start and support guide. Jetson AGX Orin features an NVIDIA Ampere architecture GPU and Arm Cortex - A78AE CPU, together with next-generation deep learning and vision accelerators. High-speed IO, 204GB/s of memory bandwidth, and 32GB of DRAM are capable of feeding multiple concurrent AI application pipelines. With Jetson AGX Orin, developers can now deploy large and complex models to solve problems like natural language understanding, 3D perception, and multi-sensor fusion.
Features
Specification
Jetson AGX Orin module
AI Performance |
275 TOPS (INT8) |
GPU |
NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor Cores |
Max GPU Freq |
1 GHz |
CPU |
12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
CPU Max Freq |
2 GHz |
DL Accelerator |
2x NVDLA v2.0 |
Vision Accelerator |
PVA v2.0 |
Memory |
32GB 256-bit LPDDR5 204.8 GB/s |
Storage |
64GB eMMC 5.1 |
CSI Camera |
Up to 6 cameras (16 via virtual channels*) 16 lanes MIPI CSI-2 D-PHY 1.2 (up to 40Gbps) | C-PHY 1.1 (up to 164Gbps) |
Video Encode |
2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) |
Video Decode |
1x 8K30 | 3x 4K60 | 6x 4K30 | 12x 1080p60| 24x 1080p30 (H.265) |
UPHY |
2 x8 (or 1×8 + 2×4), 1 x4, 2 x1 (PCIe Gen4, Root Port & Endpoint) 3x USB 3.2 Single lane UFS |
Networking |
1x GbE 4x 10GbE |
Display |
1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
Other I/O |
4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
Power |
15W | 30W | 50W |
Mechanical |
100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
Jetson AGX Orin Reference Carrier Board
Camera |
16 lane MIPI CSI-2 connector |
PCIe |
x16 PCIe slot supporting x8 PCIe Gen4 |
RJ45 |
Up to 10 GbE |
M.2 Key M |
x4 PCIe Gen 4 |
USB Type-C |
2x USB 3.2 Gen2 with USB-PD support |
USB Type-A |
4x USB 3.2 Gen2 |
USB Micro-B |
USB 2.0 |
DisplayPort |
DisplayPort 1.4a (+MST) |
microSD slot |
UHS-1 cards up to SDR104 mode |
Other |
40-pin header (I2C, GPIO, SPI, CAN, I2S, UART, DMIC) 12-pin automation header10-pin audio panel header 10-pin JTAG header 4-pin fan header 2-pin RTC battery backup connector DC power jack Power, Force Recovery, and Reset buttons |
Dimensions |
110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution) |
Part List
Jetson AGX Orin Developer Kit x1